Composite electronic component and board having the same

ABSTRACT

A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2017-0109472 filed on Aug. 29, 2017 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a composite electronic component and aboard having the same.

2. Description of Related Art

A multilayer ceramic capacitor is a type of multilayer electroniccomponent, and is a chip type condenser commonly mounted on the circuitboards of various electronic products, including display devices such asliquid crystal displays (LCDs), plasma display panels (PDPs), and thelike, computers, personal digital assistants (PDAs), mobile phones, andthe like. The multilayer ceramic capacitor typically serves to charge ordischarge electricity.

The multilayer ceramic capacitor (MLCC) may be used as a component invarious electronic apparatuses due to advantages thereof such as a smallsize, high capacitance, and case of mountability.

The multilayer ceramic capacitor may have a structure in which aplurality of dielectric layers are provided, and internal electrodeswith different polarities are alternately stacked between the dielectriclayers.

Since the dielectric layer as described above has piezoelectric andelectrostrictive properties, when a direct current (DC) or alternatingcurrent (AC) voltage is applied to the multilayer ceramic capacitor, apiezoelectric phenomenon may occur between the internal electrodes,thereby generating vibrations.

These vibrations are transferred to a circuit board on which themultilayer ceramic capacitor is mounted through external electrodes ofthe multilayer ceramic capacitor, such that an entire circuit board canbecome a sound reflecting surface that transmits the sound of vibrationsas noise.

The sound of vibrations may correspond to an audio frequency within arange of 20 to 20,000 Hz potentially causing user discomfort. Thevibration noise causing listener discomfort as described above is knownas acoustic noise.

In accordance with the recent trend for slimness and miniaturization ofelectronic devices, the multilayer ceramic capacitor has been usedtogether with a printed circuit board in high voltage and large voltagechange environments, and thus, such acoustic noise may be experienced bya user.

Therefore, a novel product capable of decreasing acoustic noise has beencontinuously demanded.

Meanwhile, research into a composite electronic component in which aprinted circuit board is used below a multilayer ceramic capacitor inorder to decrease acoustic noise has been conducted.

However, in this case, acoustic noise may be decreased, but since acurrent path may be extended when an alternating current voltage isapplied, a side effect that equivalent series inductance (ESL) isincreased may occur.

SUMMARY

An aspect of the present disclosure may provide a composite electroniccomponent capable of simultaneously decreasing acoustic noise and ESL,and a board having the same.

According to an aspect of the present disclosure, a composite electroniccomponent may include a composite body that includes a multilayerceramic capacitor and a ceramic chip. The multilayer ceramic capacitorincludes a first ceramic body in which a plurality of dielectric layersand internal electrodes disposed to face each other with respectivedielectric layers interposed therebetween are stacked, and first andsecond external electrodes are disposed on both end portions of thefirst ceramic body. The ceramic chip is coupled to the multilayerceramic capacitor, is disposed on a lower portion of the multilayerceramic capacitor, and includes a second ceramic body and first andsecond terminal electrodes disposed on both end portions of the secondceramic body and connected to the first and second external electrodes,respectively. A plurality of electrodes are disposed in the secondceramic body.

The second ceramic body may contain a paraelectric material.

According to another aspect of the present disclosure, a board having acomposite electronic component may include a printed circuit board onwhich a plurality of electrode pads are disposed, the compositeelectronic component as described above mounted on the printed circuitboard, and a solder connecting the electrode pads and the compositeelectronic component to each other.

According to a further aspect of the present disclosure, a compositeelectronic component may include a multilayer ceramic capacitor and aceramic chip. The multilayer ceramic capacitor includes first and secondinternal electrodes alternately stacked to overlap with each other in aceramic body. The ceramic chip has the multilayer ceramic capacitormounted to a first surface thereof, and includes a plurality of planarelectrodes disposed therein and overlapping with each other. Thecomposite electronic component has a mounting surface for mounting to aprinted circuit board, and the mounting surface is a second surface ofthe ceramic chip that is disposed opposite the first surface of theceramic chip on which the multilayer ceramic capacitor is mounted.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to a first exemplary embodiment;

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1;

FIG. 3 is a partially cutaway perspective view schematicallyillustrating a multilayer ceramic capacitor according to a secondexemplary embodiment of the composite electronic component of FIG. 1;

FIG. 4 is a cross-sectional diagram taken along the line I-I′ of FIG. 1according to a third exemplary embodiment;

FIG. 5 is a cross-sectional diagram taken along the line I-I′ of FIG. 1according to a fourth exemplary embodiment;

FIG. 6 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of the compositeelectronic component of FIG. 1;

FIG. 7 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of another example ofthe composite electronic component of FIG. 1;

FIG. 8 is a perspective view schematically illustrating a compositeelectronic component according to a fifth exemplary embodiment;

FIG. 9 is a perspective view schematically illustrating a compositeelectronic component according to a sixth exemplary embodiment;

FIG. 10 is a perspective view schematically illustrating a compositeelectronic component according to a seventh exemplary embodiment;

FIG. 11 is a perspective view illustrating a board in which thecomposite electronic component of FIG. 1 is mounted on a printed circuitboard; and

FIG. 12 is a cross-sectional view taken along line II-II′ of FIG. 11.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments will be described in detail withreference to the accompanying drawings.

Composite Electronic Component

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to a first exemplary embodiment.

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

Referring to FIG. 1, in the composite electronic component according tothe exemplary embodiment in the present disclosure, a ‘length direction’refers to an ‘L’ direction of FIG. 1, a ‘width direction’ refers to a‘W’ direction of FIG. 1, and a ‘thickness direction’ refers to a ‘T’direction of FIG. 1. Here, the ‘thickness direction’ may be the same asa direction in which dielectric layers of a capacitor are stacked, thatis, a ‘stacking direction’.

Meanwhile, in the exemplary embodiment, the composite electroniccomponent may have upper and lower surfaces opposing each other, firstand second end surfaces opposite each other in the length direction andthird and fourth side surfaces opposite each other in the widthdirection that connect the upper and lower surfaces to each other. Ashape of the composite electronic component is not particularly limited,but may be a hexahedral shape as illustrated.

In addition, the first and second end surfaces of the compositeelectronic component opposite each other in the length direction may bereferred to as surfaces in the same directions as directions of firstand second end surfaces of the multilayer ceramic capacitor and theceramic chip opposite each other in the length direction. The third andfourth side surfaces of the composite electronic component opposite eachother in the width direction may be referred to as third and fourth sidesurfaces of the multilayer ceramic capacitor and the ceramic chipopposite each other in the width direction, respectively, as describedbelow.

Meanwhile, in the composite electronic component, the multilayer ceramiccapacitor and the ceramic chip may be coupled to each other, and in acase in which the ceramic chip is coupled to a lower portion of themultilayer ceramic capacitor, the upper surface of the compositeelectronic component may be defined as an upper surface of themultilayer ceramic capacitor, and a lower surface of the compositeelectronic component may be defined as a lower surface of the ceramicchip.

Referring to FIGS. 1 and 2, the composite electronic component accordingto the first exemplary embodiment may include a composite body 300 inwhich a multilayer ceramic capacitor 100 and a ceramic chip 200 arecoupled to each other. The multilayer ceramic capacitor 100 includes afirst ceramic body 110 in which a plurality of dielectric layers 111 andinternal electrodes 121 and 122 disposed to face each other withrespective dielectric layers 111 interposed therebetween are stacked andfirst and second external electrodes 131 and 132 disposed on both endportions of the first ceramic body 110. The ceramic chip 200 is disposedon a lower portion or surface of the multilayer ceramic capacitor 100and includes a second ceramic body 210 and first and second terminalelectrodes 231 and 232 disposed on both end portions of the secondceramic body 210 and connected to the first and second externalelectrodes 131 and 132, respectively.

According to the exemplary embodiment, a plurality of electrodes 221 and222 may be disposed in the second ceramic body 210.

According to the related art, research into a composite electroniccomponent in which a printed circuit board was used on a lower surfaceof a multilayer ceramic capacitor in order to decrease acoustic noisehas been conducted.

However, in a case of using the printed circuit board on a lower surfaceof the multilayer ceramic capacitor, acoustic noise may be decreased,but since a current path is extended corresponding to a thickness of theprinted circuit board when an alternating current voltage is applied, aside effect in which equivalent series inductance (ESL) is increased mayoccur.

According to the exemplary embodiment, the ceramic chip 200 may bedisposed on the lower portion of the multilayer ceramic capacitor 100 inorder to decrease acoustic noise, but the plurality of electrodes 221and 222 may be disposed in the second ceramic body 210, such that acurrent path may be shortened, thereby decreasing acoustic noise withoutan increase in ESL.

More specifically, the plurality of electrodes 221 and 222 may becomposed of a first electrode 221 connected to the first terminalelectrode 231 of the ceramic chip 200 and a second electrode 222connected to the second terminal electrode 232.

The numbers of first and second electrodes 221 and 222 stacked in thesecond ceramic body 210 are not particularly limited, but may each be atleast one. That is, a total of at least 2 electrodes may be stacked inthe second ceramic body 210, and the number of stacked first and secondelectrodes 221 and 222 may be suitably adjusted. Although a case inwhich the number of first electrode 221 is one and the number of secondelectrode 222 is two is illustrated in FIG. 2, the numbers of first andsecond electrodes 221 and 222 are not necessarily limited thereto.

The first electrode 221 may be exposed to one surface of the secondceramic body 210, and more specifically to a first end surface thereofin the length direction, to thereby be connected to the first terminalelectrode 231. The second electrode 222 may be exposed to the othersurface of the second ceramic body 210, and more specifically to asecond end surface thereof in the length direction, to thereby beconnected to the second terminal electrode 232.

The first and second terminal electrodes 231 and 232 of the ceramic chip200 may be connected to the first and second external electrodes 131 and132 of the multilayer ceramic capacitor 100, respectively.

According to the related art, there is a problem in that when analternating current voltage is applied, since a current path is extendedby a distance corresponding to a thickness of a printed circuit board,equivalent series inductance (ESL) is increased. However, according tothe exemplary embodiment, since the current path is formed along thefirst and second electrodes 221 and 222 disposed in the ceramic chip 200mounted on a printed circuit board while directly coming in contact witha mounting surface of the printed circuit board, acoustic noise may bedecreased without an increase in ESL, unlike the composite electroniccomponent according to the related art.

Hereinafter, the multilayer ceramic capacitor 100 and the ceramic chip200 configuring the composite body 300 will be described in detail.

Referring to FIG. 2, the first ceramic body 110 configuring themultilayer ceramic capacitor 100 may be formed by stacking the pluralityof dielectric layers 111, and a plurality of internal electrodes 121 and122 (sequentially first and second internal electrodes) may be disposedin the first ceramic body 110 to be separated from each other withrespective dielectric layers 111 interposed therebetween.

The plurality of dielectric layers 111 configuring the first ceramicbody 110 may be in a sintered state, and adjacent dielectric layers 111may be integrated with each other so that boundaries therebetween arenot readily apparent.

The dielectric layer 111 may be formed by sintering a ceramic greensheet containing a ceramic powder, an organic solvent, and an organicbinder. The ceramic powder, which is a material having highpermittivity, may be a barium titanate (BaTiO₃) based material, astrontium titanate (SrTiO₃) based material, or the like, but is notlimited thereto.

That is, the dielectric layer 111 configuring the first ceramic body 110may contain a ferroelectric material, but is not necessarily limitedthereto.

Meanwhile, according to the first exemplary embodiment, the internalelectrodes may include first internal electrodes 121 exposed to a firstend surface of the composite body 300 in the length direction and secondinternal electrodes 122 exposed to a second end surface thereof in thelength direction, but the internal electrodes are not limited thereto.

The first and second internal electrodes 121 and 122 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oralloys thereof, but is not limited thereto.

The first and second internal electrodes 121 and 122 may be printed onthe ceramic green sheets forming the dielectric layers 111, using theconductive paste by a printing method such as screen printing method ora gravure printing method.

The first ceramic body 110 may be formed by alternately stacking andsintering the ceramic green sheets on which the internal electrode isprinted.

The plurality of first and second internal electrodes 121 and 122 may bedisposed to be horizontal (e.g., parallel) relative to the upper andlower surfaces of the first ceramic body 110.

Meanwhile, the first and second external electrodes 131 and 132 may beformed of a conductive paste including a conductive metal, wherein theconductive metal may be nickel (Ni), copper (Cu), palladium (Pd), gold(Au), or alloys thereof, but is not limited thereto.

Further, nickel/tin (Ni/Sn) plating layers may be further disposed onthe first and second external electrodes 131 and 132.

According to the first exemplary embodiment, the ceramic chip 200 may becoupled to the lower portion of the multilayer ceramic capacitor 100 tothereby be disposed thereon.

In the ceramic chip 200, the first and second terminal electrodes 231and 232 connected to the first and second external electrodes 131 and132 may be disposed on both end portions of the second ceramic body 210formed of a bulk shaped ceramic material.

In general, in order to significantly decrease the transferring ofvibration of a multilayer ceramic capacitor to a printed circuit board,there was an attempt to insert an intermediate medium between themultilayer ceramic capacitor and the printed circuit board.

However, since the intermediate medium is formed of a material havingelasticity as a resin generally used to manufacture a printed circuitboard, the intermediate medium may serve to absorb vibrations of themultilayer ceramic capacitor through elasticity of the intermediatemedium.

On the contrary, according to the first exemplary embodiment describedherein, since the second ceramic body 210 of the ceramic chip 200 isformed of only a hard ceramic material that is not elastically deformed,the printed circuit board and the multilayer ceramic capacitor 100 maybe spaced apart from each other by the ceramic chip 200, therebyblocking vibration itself generated in the multilayer ceramic capacitor100 from being transferred.

According to the first exemplary embodiment, the second ceramic body 210may contain a paraelectric material, but is not necessarily limitedthereto.

Since the paraelectric material does not have piezoelectric properties,the paraelectric material may suppress vibrations generated in themultilayer ceramic capacitor 100 from being transferred, such that theceramic chip 200 including the second ceramic body 210 containing theparaelectric material is disposed on the lower portion of the multilayerceramic capacitor 100 to decrease acoustic noise.

Further, in a case in which the second ceramic body 210 of the ceramicchip 200 is formed of the paraelectric material, it may be easy todispose the plurality of electrodes 221 and 222 in the second ceramicbody 210, such that the composite electronic component is capable ofdecreasing acoustic noise without an increase in ESL, unlike thecomposite electronic component according to the related art.

That is, in a case in which the resin, alumina (Al₂O₃), or the like,generally used to manufacture a printed circuit board is used in theintermediate medium as in the related art, it may be difficult to insertelectrodes into the intermediate medium, such that it may not be easy toimplement a structure according to the present disclosure.

The paraelectric material is not particularly limited as long as it hasparaelectric properties. For example, the paraelectric material may be amaterial represented by (Ca_(1-x)Sr_(x))(Zr_(1-y)Ti_(y))O₃,Ca(Zr_(1-y)Ti_(y))O₃, Sr(Zr_(1-y)Ti_(y))O₃, (Ca_(1-x)Sr_(x))ZrO₃, and(Ca_(1-x)Sr_(x))TiO₃.

According to another exemplary embodiment, a ceramic materialconfiguring the second ceramic body 210 may be the same as thatcontained in the first ceramic body 110 configuring the multilayerceramic capacitor 100.

That is, the ceramic material configuring the second ceramic body 210,which is a material having high permittivity, may be a barium titanate(BaTiO₃) based material, a strontium titanate (SrTiO₃) based material,or the like, but is not limited thereto.

That is, the second ceramic body 210 may contain a ferroelectricmaterial.

When the ceramic material configuring the second ceramic body 210 is thesame as the ferroelectric material, which is the ceramic materialconfiguring the first ceramic body 110, the ceramic chip 200 may havepiezoelectric properties, but since phases of vibration generated in themultilayer ceramic capacitor 100 and vibration generated in the ceramicchip 200 are different from each other, acoustic noise may nonethelessbe decreased.

That is, while vibration generated in the multilayer ceramic capacitor100 is transferred to the ceramic chip 200, a phase of piezoelectricvibration is changed, such that a vibration cancellation effect may beexhibited, thereby decreasing overall acoustic noise.

Further, in a case in which the second ceramic body 210 of the ceramicchip 200 is formed of the same material as the dielectric materialconfiguring the first ceramic body 110 of the multilayer ceramiccapacitor 100, it may be easy to dispose the plurality of electrodes 221and 222 in the second ceramic body 210, such that the compositeelectronic component capable of decreasing acoustic noise without anincrease in ESL, unlike the composite electronic component according tothe related art, may be implemented.

Meanwhile, the plurality of electrodes 221 and 222 disposed in thesecond ceramic body 210, that is, the first and second electrodes 221and 222 may each be exposed to a respective one of the first and secondend surfaces of the second ceramic body 210 in the length direction.

The first and second electrodes 221 and 222 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oralloys thereof, but is not limited thereto.

A method of inserting the first and second electrodes 221 and 222 in thesecond ceramic body 210 may be performed by printing a conductive pasteon a ceramic green sheet using a printing method such as a screenprinting method or a gravure printing method, similarly to a method offorming the first and second internal electrodes 121 and 122 in thefirst ceramic body 110.

That is, the method of inserting the first and second electrodes 221 and222 in the second ceramic body 210 is similar to a method of forminginternal electrodes of a general multilayer ceramic capacitor, such thatthe first and second electrodes 221 and 222 may be manufactured withouta particular difficulty in a manufacturing process.

The second ceramic body 210 may be formed by alternately stacking andsintering ceramic green sheets on which one of the first and secondinternal electrodes is printed.

The first and second electrodes 221 and 222 may be disposed to behorizontal (e.g., parallel) relative to upper and lower surfaces of thesecond ceramic body 210, but is not necessarily limited thereto. Thatis, the first and second electrodes 221 and 222 may be disposed to beperpendicular to the upper and lower surfaces of the second ceramic body210. When the first and second electrodes 221 and 222 are disposed to beperpendicular to the lower surface of the second ceramic body 210, thatis, a mounting surface thereof, an effect of decreasing ESL may be moreexcellent.

Although not particularly limited, the first and second terminalelectrodes 231 and 232 may have, for example, a double layer structurecomposed of first and second conductive resin layers at inner portionsthereof and first and second plating layers at outer portions thereof.

According to the first exemplary embodiment, since the first and secondterminal electrodes 231 and 232 have the double layer structure composedof the first and second conductive resin layers at the inner portionsthereof and the first and second plating layers at the outer portionsthereof, when mechanical stress is applied thereto from the outside, theceramic chip 200 and the conductive resin layers used as the terminalelectrodes 231 and 232 of the ceramic chip 200 may suppress stress frombeing transferred to the multilayer ceramic capacitor 100, therebypreventing the multilayer ceramic capacitor 100 from being damaged bycracks.

The first and second conductive resin layers may contain a conductivemetal and a thermosetting resin, for example, silver (Ag) and an epoxyresin, but are not limited thereto.

FIG. 3 is a partially cutaway perspective view schematicallyillustrating a multilayer ceramic capacitor according to a secondexemplary embodiment in the composite electronic component of FIG. 1.

In the multilayer ceramic capacitor according to the second exemplaryembodiment, a plurality of first and second internal electrodes 121 and122 may be disposed to be perpendicular to upper and lower surfaces of afirst ceramic body 110.

That is, the first and second internal electrodes 121 and 122 may bestacked to be perpendicular to a mounting surface of a composite body300 at the time of mounting the composite body 300 on a printed circuitboard.

In general, when a voltage is applied to a multilayer ceramic capacitor,a ceramic body may be repeatedly expanded and contracted in length,width, and thickness directions due to an inverse piezoelectric effectof dielectric layers.

That is, in a case of actually measuring displacement amounts in amultilayer ceramic capacitor in the orientation shown in FIG. 2,displacement amounts of a surface (LW surface) of the ceramic body in alength-width direction (e.g. a surface parallel to internal electrodes121, 122 of the capacitor), a surface (WT surface) of the ceramic bodyin a width-thickness direction (e.g., an end surface), and a surface (LTsurface) of the ceramic body in a length-thickness direction (e.g., aside surface) using a laser doppler vibrometer (LDV), the displacementamount is decreased in a sequence of the LW surface, the WT surface, andthe LT surface.

The displacement amount of the LT surface is about 42% or so, based onthat of the WT surface, such that the displacement amount of the LTsurface may be smaller than that of the WT surface. The reason may bethat stress having the same magnitude is generated in the LT surface andthe WT surface, but particularly, since the LT surface has a relativelywide area as compared to the WT surface, stress having a similarmagnitude may be distributed throughout the wide area, such thatrelatively small deformation may occur.

Therefore, it may be appreciated that in the general multilayer ceramiccapacitor, the displacement amount is the smallest in the LT surface.

That is, according to the second exemplary embodiment, the first andsecond internal electrodes 121 and 122 may be stacked to beperpendicular to the upper and lower surfaces of the first ceramic body110, such that at the time of mounting the composite body 300 on theprinted circuit board, the first and second internal electrodes 121 and122 may be disposed to be perpendicular to the mounting surface, therebysignificantly decreasing a vibration amount of a surface of the firstceramic body 110 coming in contact with the ceramic chip 200.

FIG. 4 is a cross-sectional diagram taken along the line I-I′ of FIG. 1according to a third exemplary embodiment.

Referring to FIG. 4, in the composite electronic component according tothe third exemplary embodiment, a plurality of electrodes 221 and 222disposed in a second ceramic body 210 may be disposed to be adjacent toa mounting surface of a composite body.

The first and second electrodes 221 and 222 may be disposed to behorizontal (e.g., parallel) relative to upper and lower surfaces of thesecond ceramic body 210 and be adjacent to the mounting surface of thecomposite body, such that even though a thickness of the ceramic chip200 is increased in order to increase an effect of decreasing acousticnoise, ESL may not be increased.

Generally, when a ceramic chip is disposed on a lower surface of amultilayer ceramic capacitor, an effect of decreasing acoustic noise isincreased in proportion to a thickness of the ceramic chip. However, ina case of increasing the thickness of the ceramic chip in order toincrease the effect of decreasing acoustic noise, a current path may befurther extended, such that ESL may be increased.

According to the third exemplary embodiment, a current path may not beextended by disposing the plurality of electrodes 221 and 222 disposedin the second ceramic body 210 to be adjacent to the mounting surface ofthe composite body 300 in the case of increasing the thickness of theceramic chip in order to increase the effect of decreasing acousticnoise. Therefore, ESL may also not be increased.

More specifically, in an internal structure of the second ceramic body210 according to the third exemplary embodiment, a thickness of an upperceramic region (e.g., above an uppermost internal electrode among thefirst and second internal electrodes 221 and 222) may be thicker thanthat of a lower ceramic region (e.g., below a lowermost internalelectrode among the first and second internal electrodes 221 and 222)based on a position at which the first and second electrodes 221 and 222are disposed.

That is, since the thickness of the lower ceramic region based on theposition at which the first and second electrodes 221 and 222 aredisposed is thin, the first and second electrodes 221 and 222 may bedisposed to be more adjacent to (e.g., closer to) a printed circuitboard (e.g., closer to the printed circuit board than to the capacitor100), such that the current path may not be extended.

FIG. 5 is a cross-sectional diagram taken along the line I-I′ of FIG. 1according to a fourth exemplary embodiment.

A ceramic chip 200 may further include a first via electrode 241penetrating through a first electrode 221 to thereby be connected to afirst terminal electrode 231, and include a second via electrode 242penetrating through a second electrode 222 to thereby be connected to asecond terminal electrode 232.

According to the fourth exemplary embodiment, in a case of disposing theceramic chip 200 on a lower portion (or surface) of a multilayer ceramiccapacitor 100 in order to decrease acoustic noise, ESL may not beincreased by allowing the ceramic chip 200 to further include the firstvia electrode 241 penetrating through the first electrode 221 to therebybe connected to the first terminal electrode 231, and include the secondvia electrode 242 penetrating through the second electrode 222 tothereby be connected to the second terminal electrode 232.

More specifically, since the first via electrode 241 penetrating throughthe first electrode 221 to thereby be connected to the first terminalelectrode 231 and the second via electrode 242 penetrating through thesecond electrode 222 to thereby be connected to the second terminalelectrode 232 are further included in an internal structure of thesecond ceramic body 210 according to the fourth exemplary embodiment, acurrent path may be formed along the first an second via electrodes 241and 242. Thus, the current path may be shortened as compared to astructure according to the related art.

Therefore, according to the fourth exemplary embodiment, acoustic noisemay be decreased in a state in which ESL is not increased.

FIG. 6 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of the compositeelectronic component of FIG. 1.

The composite body 300 may be formed by coupling the multilayer ceramiccapacitor 100 and the ceramic chip 200 to each other, and a method offorming the composite body 300 is not particularly limited.

The composite body 300 may be formed by coupling the multilayer ceramiccapacitor 100 and the ceramic chip 200 that are separately manufacturedto each other using a high-melting point solder, a conductive adhesive213, or the like.

The conductive adhesive 213 may be a paste containing a conductive metaland an epoxy resin, but is not necessarily limited thereto.

Referring to FIG. 6, in a case of coupling the multilayer ceramiccapacitor 100 and the ceramic chip 200 using the high-melting pointsolder, the conductive adhesive 213, or the like, the conductive paste213 may be applied onto the lower surfaces of the first and secondexternal electrodes 131 and 132 to thereby be adhered to the first andsecond terminal electrodes 231 and 232 of the ceramic chip 200.

The high-melting point solder or the conductive adhesive 213 may beapplied onto the lower surfaces of the first and second externalelectrodes 131 and 132 to thereby be fixed to the ceramic chip 200 atthe lower surface of the multilayer ceramic capacitor 100, such thatonly vibration of the surface (LW surface) of the first ceramic body 110in the length-width direction may be transferred to the ceramic chip200.

Therefore, the transferring of stress and vibration generated in themultilayer ceramic capacitor 100 to the ceramic chip 200 may besignificantly decreased, such that acoustic noise may be decreased.

FIG. 7 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of another example ofthe composite electronic component of FIG. 1.

Referring to FIG. 7, the high-melting point solder or the conductiveadhesive 213 may be applied to the entire upper surface of the ceramicchip 200, which is an adhesion surface thereof adhered to the multilayerceramic capacitor 100, to thereby be fixed to the ceramic chip 200 atthe lower surface of the multilayer ceramic capacitor 100.

In a case in which the conductive adhesive 213 is applied to the entireupper surface of the ceramic chip 200, the adhesion surface of theceramic chip 200 adhered to the multilayer ceramic capacitor 100, asdescribed above, the effect of decreasing acoustic noise may be moreexcellent due to elasticity of the conductive adhesive 213.

Further, since the adhesive is applied to the entire adhesion surface,at the time of mounting the composite electronic component in a board,binding strength of the composite electronic component may be improved,such that reliability may be improved.

FIG. 8 is a perspective view schematically illustrating a compositeelectronic component according to a fifth exemplary embodiment.

Referring to FIG. 8, in the composite electronic component according tothe fifth exemplary embodiment, a length of a ceramic chip 200′ may bedifferent (e.g., longer) than that of a multilayer ceramic capacitor100, and/or a width of the ceramic chip 200′ may be different (e.g.,wider) than that of the multilayer ceramic capacitor 100.

The ceramic chip 200′ may include a second ceramic body 210′ formed of aceramic material and first and second terminal electrodes 231′ and 232′disposed on both end portions of the second ceramic body 210′ andconnected to first and second external electrodes 131 and 132.

Since the length of the ceramic chip 200′ is longer than that of themultilayer ceramic capacitor 100, and the width of the ceramic chip 200′is wider than that of the multilayer ceramic capacitor 100, at the timeof mounting the composite electronic component on a printed circuitboard, the ceramic chip 200′ may serve to block a solder from beingconnected from the printed circuit board up to the multilayer ceramiccapacitor 100 in length and width directions of the multilayer ceramiccapacitor 100.

Therefore, the transferring of vibration to the printed circuit board bythe solder may be further decreased.

FIG. 9 is a perspective view schematically illustrating a compositeelectronic component according to a sixth exemplary embodiment.

Referring to FIG. 9, in the composite electronic component according tothe sixth exemplary embodiment, a length of a ceramic chip 200″ may beshorter than that of a multilayer ceramic capacitor 100, and a width ofthe ceramic chip 200″ may be wider than that of the multilayer ceramiccapacitor 100.

The ceramic chip 200″ may include a second ceramic body 210″ formed of aceramic material and first and second terminal electrodes 231″ and 232″disposed on both end portions of the second ceramic body 210″ andconnected to first and second external electrodes 131 and 132.

Since the length of the ceramic chip 200″ is shorter than that of themultilayer ceramic capacitor 100, and the width of the ceramic chip 200″is wider than that of the multilayer ceramic capacitor 100, at the timeof mounting the composite electronic component on a printed circuitboard, the ceramic chip 200″ may serve to allow a solder to be appliedonly up to lower surfaces of the first and second external electrodes131 and 132 in a length direction of the multilayer ceramic capacitor100 and block the solder from being connected up to end or side surfacesof the multilayer ceramic capacitor 100 due to a step in a widthdirection thereof.

That is, since the length of the second ceramic chip 200″ is shorterthan that of the multilayer ceramic capacitor 100, a so-called solderpocket blocking the solder from rising up to the first and secondexternal electrodes 131 and 132 in the length direction of themultilayer ceramic capacitor 100 may be formed.

In this structure, at the time of mounting the composite electroniccomponent on a printed circuit board, the solder may be applied only upto the lower surfaces of the first and second external electrodes 131and 132 in the length direction of the multilayer ceramic capacitor 100.

Therefore, the transferring of vibration to the printed circuit board bythe solder may be further decreased.

FIG. 10 is a perspective view schematically illustrating a compositeelectronic component according to a seventh exemplary embodiment.

Referring to FIG. 10, in the composite electronic component according tothe seventh exemplary embodiment, a length of a ceramic chip 200′″ maybe shorter than that of a multilayer ceramic capacitor 100, and a widthof the ceramic chip 200′″ may be narrower than that of the multilayerceramic capacitor 100.

The ceramic chip 200′″ may include a second ceramic body 210′″ formed ofa ceramic material and first and second terminal electrodes 231′″ and232′″ disposed on both end portions of the second ceramic body 210′″ andconnected to first and second external electrodes 131 and 132.

Since the length of the ceramic chip 200′″ is shorter than that of themultilayer ceramic capacitor 100, and the width of the ceramic chip200′″ is narrower than that of the multilayer ceramic capacitor 100, atthe time of mounting the composite electronic component on a printedcircuit board, the ceramic chip 200′″ may serve to allow the solder tobe applied only up to lower surfaces of the first and second externalelectrodes 131 and 132 in length and width directions of the multilayerceramic capacitor 100, and block the solder from being connected up toend or side surfaces of the multilayer ceramic capacitor 100 in athickness direction thereof.

Therefore, the transferring of vibration to the printed circuit board bythe solder may be further decreased.

Board Having Composite Electronic Component

FIG. 11 is a perspective view illustrating a board in which thecomposite electronic component of FIG. 1 is mounted on a printed circuitboard.

FIG. 12 is a cross-sectional view taken along line II-II′ of FIG. 11.

Referring to FIGS. 11 and 12, a board 400 having a composite electroniccomponent according to the present exemplary embodiment may include aprinted circuit board 410 on which the composite electronic component ismounted and two electrode pads 421 and 422 formed on an upper surface ofthe printed circuit board 410.

The electrode pads 421 and 422 may be composed of first and secondelectrode pads 421 and 422 connected to the first and second terminalelectrodes 231 and 232 of the ceramic chip 200 of the compositeelectronic component 300, respectively.

In this case, the first and second terminal electrodes 231 and 232 ofthe ceramic chip 200 may be electrically connected to the printedcircuit board 410 by solder 430 in a state in which first and secondterminal electrodes 231 and 232 are positioned to contact the first andsecond electrode pads 421 and 422, respectively.

When a voltage is applied in a state in which the composite electroniccomponent is mounted on the printed circuit board 410 as describedabove, acoustic noise may be generated.

That is, when voltages having different or varying polarities areapplied to the first and second external electrodes 131 and 132 disposedon both end surfaces of the multilayer ceramic capacitor 100 of thecomposite electronic component in the length direction in a state inwhich the composite electronic component 300 is mounted on the printedcircuit board 410, the first ceramic body 110 may be expanded andcontracted in the thickness direction by an inverse piezoelectric effectof the dielectric layer(s) 111, and both side portions of the first andsecond external electrodes 131 and 132 may be contracted and expanded bya Poisson effect in opposition to expansion and contraction of the firstceramic body 110 in the thickness direction.

Here, in the composite electronic component according to the exemplaryembodiment, the ceramic chip 200 may be disposed on the lower portion ofthe multilayer ceramic capacitor 100, such that at the time of mountingthe composite electronic component on the printed circuit board, aproblem that the solder 430 rises up to the first and second externalelectrodes 131 and 132 of the multilayer ceramic capacitor 100 may beprevented, thereby blocking piezoelectric stress from being directlytransferred from the multilayer ceramic capacitor 100 to the printedcircuit board 410 through the solder 430 contacting the first and secondexternal electrodes 131 and 132. Therefore, acoustic noise may befurther decreased.

That is, at the time of mounting the composite electronic component 300on the printed circuit board 410, the transferring of vibrations of thecapacitor due to the inverse piezoelectric property of the capacitor tothe printed circuit board may be decreased, such that acoustic noise maybe decreased.

Further, referring to FIG. 12, in the composite electronic component 300according to the exemplary embodiment, the ceramic chip 200 may bedisposed on the lower portion of the multilayer ceramic capacitor 100 inorder to decrease acoustic noise, but the plurality of electrodes 221and 222 may be disposed in the second ceramic body 210, such that acurrent path may be shortened, thereby decreasing acoustic noise withoutan increase in ESL.

More specifically, the plurality of electrodes 221 and 222 may becomposed of the first electrode (s) 221 connected to the first terminalelectrode 231 of the ceramic chip 200 and the second electrode(s) 222connected to the second terminal electrode 232.

The first electrode (s) 221 may be exposed to one surface of the secondceramic body 210, more specifically, one end surface thereof in thelength direction, to thereby be connected to the first terminalelectrode 231, and the second electrode(s) 222 may be exposed to theother surface of the second ceramic body 210, more specifically, thesecond end surface thereof in the length direction, to thereby beconnected to the second terminal electrode 232.

The first and second terminal electrodes 231 and 232 of the ceramic chip200 may be connected to the first and second external electrodes 131 and132 of the multilayer ceramic capacitor 100, respectively.

According to the related art, there is a problem in that when analternating current voltage is applied, since a current path is extendedby a distance corresponding to a thickness of an intermediate printedcircuit board used for vibration attenuation, equivalent seriesinductance (ESL) is increased. However, according to the exemplaryembodiment, since the current path is formed along the first and secondelectrodes 221 and 222 disposed in the ceramic chip 200 mounted on aprinted circuit board while directly coming in contact with a mountingsurface of the printed circuit board, acoustic noise may be decreasedwithout an increase in ESL, unlike the composite electronic componentaccording to the related art.

Hereafter, although the present disclosure will be described in detailwith reference to various Inventive Examples, the present disclosure isnot limited thereto.

Experimental Example

Composite electronic components according to Inventive Examples andComparative Examples were manufactured as follows.

Comparative Example 1 is a reference example for comparing acousticnoise levels and ESL values of the composite electronic componentsaccording to the Inventive Example and Comparative Example. InComparative Example 1, only a multilayer ceramic capacitor wasmanufactured as a single component without disposing a ceramic chip on alower portion of the multilayer ceramic capacitor.

In Comparative Examples 2 to 5 corresponding to composite electroniccomponents according to Comparative Examples detailed in the presentdisclosure, a ceramic chip was disposed on a lower portion of amultilayer ceramic capacitor but electrodes were not inserted in theceramic chip.

More specifically, in Comparative Example 2, the ceramic chip wasmanufactured at a thickness of 0.2 mm, in Comparative Example 3, theceramic chip was manufactured at a thickness of 0.4 mm, in ComparativeExample 4, the ceramic chip was manufactured at a thickness of 0.6 mm,and in Comparative Example 5, the ceramic chip was manufactured at athickness of 0.8 mm.

In Inventive Examples 1 to 6 corresponding to composite electroniccomponents according to the exemplary embodiments, a ceramic chip wasdisposed on a lower portion of a multilayer ceramic capacitor andelectrodes were inserted in the ceramic chip.

More specifically, in Inventive Example 1, the ceramic chip wasmanufactured at a thickness of 0.2 mm, in Inventive Example 2, theceramic chip was manufactured at a thickness of 0.4 mm, in InventiveExample 3, the ceramic chip was manufactured at a thickness of 0.6 mm,and in Inventive Example 4, the ceramic chip was manufactured at athickness of 0.8 mm.

Meanwhile, in Inventive Examples 5 and 6, via electrodes formed topenetrate first and second electrodes, respectively, were additionallyincluded in the composite electronic component in which the ceramic chipwas disposed on the lower portion of the multilayer ceramic capacitorand the electrodes were inserted in the ceramic chip.

More specifically, in Inventive Example 5, the ceramic chip wasmanufactured at a thickness of 0.4 mm, and in Inventive Example 6, theceramic chip was manufactured at a thickness of 0.6 mm.

The following Table 1 illustrates results obtained by measuring acousticnoise levels (dBA) and equivalent series inductance (ESL) values (pH) ofsamples in Comparative Examples 1 to 5 and Inventive Examples 1 to 6 ina state in which each of the samples was mounted on a printed circuitboard.

TABLE 1 Acoustic Noise (dBA) ESL (pH) Comparative Example 1 45.2 284Comparative Example 2 35.2 553 Comparative Example 3 32.6 862Comparative Example 4 30.1 1008 Comparative Example 5 29.8 1220Inventive Example 1 36.1 324 Inventive Example 2 33.1 335 InventiveExample 3 30.8 362 Inventive Example 4 28.5 355 Inventive Example 5 33.2225 Inventive Example 6 30.5 244

Referring to Table 1, in Comparative Example 1 in which a generalmultilayer ceramic capacitor was mounted on a printed circuit board, theacoustic noise level and ESL value were measured to be 45.2 dBA and 284pH, respectively.

On the other hand, in Comparative Examples 2 to 5, the acoustic noiselevels were 35.2, 32.6, 30.1, and 29.8, respectively. Therefore, it maybe appreciated that the acoustic noise was decreased as compared toComparative Example 1. On the contrary, the measured ESL values were553, 862, 1008, and 1220. Therefore, it may be appreciated that the ESLwas significantly increased as compared to Comparative Example 1 inwhich the multilayer ceramic capacitor was mounted. It may beappreciated that as the thickness of the ceramic chip was increased, theESL was also increased, and the reason may be that as the thickness ofthe ceramic chip was increased, a current path was extended. In a caseof disposing a ceramic chip on a lower portion of a multilayer ceramiccapacitor in order to decrease acoustic noise, which is a problem at thetime of mounting the multilayer ceramic capacitor alone on a printedcircuit board according to the related art, there is a problem in thatESL may be increased.

On the contrary, in Inventive Examples 1 to 6 according to the presentdisclosure, the acoustic noise levels were 36.1, 33.1, 30.8, 28.5, 33.2,and 30.5, respectively, and the ESL values were 324, 335, 362, 355, 225,and 244, respectively. Therefore, it may be appreciated that theacoustic noise was decreased with no notable increase in ESL value.

Particularly, in Inventive Examples 5 and 6 in which the via electrodespenetrating through the first and second electrodes were furtherincluded in the composite electronic component in which the electrodeswere inserted in the ceramic chip, the equivalent series inductance(ESL) value was decreased by 20% or more as compared to a case in whichonly the multilayer ceramic capacitor was mounted on the printed circuitboard, and at the same time, acoustic noise was also decreased.

As set forth above, according to exemplary embodiments presented in thepresent disclosure, stress or vibrations due to the piezoelectricproperty of the multilayer ceramic capacitor may be alleviated by theceramic chip, such that the acoustic noise generated in the printedcircuit board may be decreased.

At the same time, in the composite electronic component according to therelated art in which the ceramic chip is disposed on the lower portionof the multilayer ceramic capacitor, a side effect that ESL is increasedmay occur. However, according to the embodiments presented in thepresent disclosure, the current path may be shortened by inserting theelectrodes in the ceramic chip disposed on the lower portion of themultilayer ceramic capacitor, such that acoustic noise may be decreasedwithout an increase in ESL.

Further, the current path may be further shortened by inserting the viaelectrodes penetrating through the electrodes, respectively, in additionto inserting the electrodes in the ceramic chip, such that ESL may befurther decreased.

Further, the internal electrodes of the multilayer ceramic capacitor maybe stacked to extend perpendicularly to the mounting surface of thecomposite body, such that the surface of the first ceramic body in thelength-width direction of which a piezoelectric displacement amount issmall may be adhered to the ceramic chip, and such that the transferringof stress and vibration generated in the multilayer ceramic capacitor tothe ceramic chip may be significantly decreased, thereby decreasingacoustic noise.

In addition, a step may be formed between the multilayer ceramiccapacitor and the ceramic chip, such that the transferring of vibrationto the printed circuit board by solder may be significantly decreased byblocking the solder from being formed or extending in the thicknessdirection of the multilayer ceramic capacitor.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A composite electronic component comprising: acomposite body comprising: a multilayer ceramic capacitor including afirst ceramic body in which a plurality of dielectric layers andinternal electrodes disposed to face each other with respectivedielectric layers interposed therebetween are stacked, and first andsecond external electrodes disposed on both end portions of the firstceramic body; and a ceramic chip coupled to the multilayer ceramiccapacitor, the ceramic chip being disposed on a lower portion of themultilayer ceramic capacitor and including a second ceramic body andfirst and second terminal electrodes disposed on both end portions ofthe second ceramic body and connected to the first and second externalelectrodes, respectively, wherein a plurality of electrodes are disposedin the second ceramic body so as to be disposed closer to a firstsurface of the second ceramic body than to a second surface of thesecond ceramic body opposite the first surface and on which themultilayer ceramic capacitor is coupled.
 2. The composite electroniccomponent of claim 1, herein the second ceramic body contains aparaelectric material.
 3. The composite electronic component of claim 1,wherein the internal electrodes in the first ceramic body are stacked tobe perpendicular to a surface of the first ceramic body on which theceramic chip is coupled.
 4. The composite electronic component of claim1, wherein the plurality of electrodes disposed in the second ceramicbody includes a first planar electrode connected to the first terminalelectrode, and a second planar electrode connected to the secondterminal electrode and overlapping the first planar electrode in astacking direction perpendicular to the first and second planarelectrodes.
 5. The composite electronic component of claim 1, whereinthe plurality of electrodes in the second ceramic body includes a firstelectrode connected to the first terminal electrode and a secondelectrode connected to the second terminal electrode, and the ceramicchip further includes a first via electrode penetrating through thefirst electrode to thereby be connected to the first terminal electrodeand a second via electrode penetrating through the second electrode tothereby be connected to the second terminal electrode.
 6. The compositeelectronic component of claim 1, wherein the multilayer ceramiccapacitor and the ceramic chip are coupled to each other by a conductiveadhesive applied to surfaces of the first and second external electrodesthat face the ceramic chip.
 7. The composite electronic component ofclaim 1, wherein the multilayer ceramic capacitor and the ceramic chipare coupled to each other by a conductive adhesive applied to an entireadhesion surface of the ceramic chip that faces the multilayer ceramiccapacitor.
 8. The composite electronic component of claim 1, wherein alength of the ceramic chip, in a length direction extending between theend portions on which the first and second terminal electrodes aredisposed, is longer than a length of the multilayer ceramic capacitor inthe length direction.
 9. The composite electronic component of claim 8,wherein a width of the ceramic chip, in a width direction perpendicularto the length direction, is wider than a width of the multilayer ceramiccapacitor in the width direction.
 10. The composite electronic componentof claim 1, wherein a length of the ceramic chip, in a length directionextending between the end portions on which the first and secondterminal electrodes are disposed, is shorter than a length of themultilayer ceramic capacitor in the length direction.
 11. The compositeelectronic component of claim 1, wherein a length of the ceramic chip,in a length direction extending between the end portions on which thefirst and second terminal electrodes are disposed, is shorter than alength of the multilayer ceramic capacitor in the length direction, anda width of the ceramic chip, in a width direction perpendicular to thelength direction, is narrower than a width of the multilayer ceramiccapacitor in the width direction.
 12. A board having a compositeelectronic component, the board comprising: a printed circuit board onwhich a plurality of electrode pads are disposed; the compositeelectronic component of claim 1 mounted on the printed circuit board;and a solder connecting the electrode pads and the composite electroniccomponent to each other.
 13. The board of claim 12, wherein the secondceramic body contains a paraelectric material.
 14. The board of claim12, wherein the internal electrodes in the first ceramic body arestacked to be perpendicular to a mounting surface of the composite bodythat faces the printed circuit board.
 15. The board of claim 12, whereinthe first surface of the second ceramic body functions as a mountingsurface of the second ceramic body that faces the printed circuit board.16. The board of claim 12, wherein the plurality of electrodes in thesecond ceramic body includes a first electrode connected to the firstterminal electrode and a second electrode connected to the secondterminal electrode, and the ceramic chip further includes a first viaelectrode penetrating through the first electrode to thereby beconnected to the first terminal electrode and a second via electrodepenetrating through the second electrode to thereby be connected to thesecond terminal electrode.
 17. The board of claim 12, wherein theceramic chip is disposed between the printed circuit board and themultilayer ceramic capacitor.
 18. A composite electronic componentcomprising: a multilayer ceramic capacitor comprising first and secondinternal electrodes alternately stacked to overlap with each other in aceramic body; and a ceramic chip having the multilayer ceramic capacitormounted to a second surface thereof, the ceramic chip comprising aplurality of planar electrodes that are disposed therein, areoverlapping with each other, and are disposed closer to a first surfaceof the ceramic chip than to the second surface of the ceramic chipopposite the first surface, wherein the composite electronic componenthas a mounting surface for mounting to a printed circuit board, and themounting surface is the first surface of the ceramic chip that isdisposed opposite the second surface of the ceramic chip on which themultilayer ceramic capacitor is mounted.
 19. The composite electroniccomponent of claim 18, wherein the composite electronic componentcomprises first and second terminal electrodes disposed on the mountingsurface thereof, the plurality of planar electrodes of the ceramic chipcomprises first and second planar electrodes overlapping with each otherin a stacking direction, and the first terminal electrode iselectrically connected to the first planar electrode of the ceramic chipand the first internal electrodes of the multilayer ceramic capacitor,and the second terminal electrode is electrically connected to thesecond planar electrode of the ceramic chip and the second internalelectrodes of the multilayer ceramic capacitor.
 20. The compositeelectronic component of claim 19, wherein the multilayer ceramiccapacitor comprises first and second external electrodes disposed onopposing end portions of the ceramic body and respectively connected tothe first and second internal electrodes, and the ceramic chip comprisesfirst and second terminal electrodes disposed on the mounting surface ofthe composite electronic component and respectively connected to thefirst and second external electrodes of the multilayer ceramiccapacitor.
 21. The composite electronic component of claim 18, whereinthe first and second internal electrodes of the multilayer ceramiccapacitor are orthogonal to the planar electrodes of the ceramic chip.22. The composite electronic component of claim 18, wherein the firstand second internal electrodes of the multilayer ceramic capacitor areexposed to respective opposite surfaces of the ceramic body in a lengthdirection, and the ceramic chip has a length, measured in the lengthdirection, different from a length of the multilayer ceramic capacitor,measured in the length direction.
 23. The composite electronic componentof claim 18, wherein the first and second internal electrodes of themultilayer ceramic capacitor are exposed to respective opposite surfacesof the ceramic body in a length direction, and the ceramic chip has awidth, measured in a width direction orthogonal to the length direction,different from a width of the multilayer ceramic capacitor, measured inthe width direction.